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MASSTART

financed

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MASS manufacturing of TrAnsceiveRs for Terabit s era

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European l... see more

30/06/2023

Fraunhofer

7M€

Project Budget: 7M€

Project leader

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANG... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

Ver 11 Participantes

Financing granted El organismo H2020 notifico la concesión del proyecto The day 2023-06-30

ICT-04-2018: Photonics based manufacturing, acce... Specific Challenge:Photonics research in Europe is widely recognized for its excellence; researchers...

I+D

Cerrada does 7 years

0% 82% 100%

characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

11 Participantes

Fraunhofer

1.46M€ | Leader

Almae Technologies SAS

406.36K€ | participant

Tektronix GmbH

N.D. | participant

Institut Néel - UPR2940

271.25K€ | participant

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Project duration: 54 months Date Start: 2018-12-05
End date: 2023-06-30

Project leader

FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANG... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 7M€

participation deadline Sin fecha límite de participación.

Project description MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade. MASSTART will surpass the cost metric threshold by using enhanced and scalable techniques: i) glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density, while facilitating automated assembly processes, ii) 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier iii) a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and iv) wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device. This process flow will be assessed with the fabrication and characterization of four different demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are: i) a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate, ii) an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate, iii) a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and iv) a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate. Finally, MASSTART will interact closely with international bodies to ensure the compliance and standardization of the developed technology with other proposed packaging form factors for rapid commercialization.

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