Printed electronics is at the forefront of industrial and academic research as the technology promises to play a vital role in enabling low-cost electronic devices on unconventional substrates. The technique has progressed from pr...
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Información proyecto MOVE
Duración del proyecto: 30 meses
Fecha Inicio: 2021-03-29
Fecha Fin: 2023-09-30
Fecha límite de participación
Sin fecha límite de participación.
Descripción del proyecto
Printed electronics is at the forefront of industrial and academic research as the technology promises to play a vital role in enabling low-cost electronic devices on unconventional substrates. The technique has progressed from printing text and graphics to a tool for rapid and versatile manufacturing. Devices such as field-effect transistors (FETs), light-emitting diodes, photodetectors, photovoltaic cells, sensors and photonic devices can be assembled layer-by-layer from electronic inks. A FET is one of the most fundamental devices in modern computing and is essential for technology we use in our daily lives from smartphones to displays. Therefore, the project will focus on improving state-of-the-art printed FETs. Electronic inks of semiconducting two-dimensional (2D) flakes have emerged as a possible route to improve device mobility (μ > 20 cm2 V-1 s−1) and current on/off ratio (Ion/Ioff as > 106) at room temperature (20°C) in ambient atmosphere. Similarly, dielectric 2D flakes have the potential to enable printed FETs with low voltage operation (<5V) with low gate leakage currents (<1 nA). However, a large amount of work, training and international collaboration will be required to engineer novel electronic inks from 2D flakes and assemble them as printed multi-component functional networks. The project will enable an experienced researcher to move internationally and work in a world-leading research centre with modern infrastructure and intersectoral collaboration while developing scientific and transferable skills. If successful, MOVE will revolutionize printed FETs and offer a new path forward to enabling entirely printed integrated circuits.