MACALO has two main deliverables, one in software and one in hardware which form the core business of the two European high-tech companies in the consortium. The MACALO consortium consists of pioneers of MAgnetoCALOritronics who c...
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31/08/2013
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4M€
Presupuesto del proyecto: 4M€
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Información proyecto MACALO
Líder del proyecto
SINTEF AS
No se ha especificado una descripción o un objeto social para esta compañía.
Presupuesto del proyecto
4M€
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Sin fecha límite de participación.
Descripción del proyecto
MACALO has two main deliverables, one in software and one in hardware which form the core business of the two European high-tech companies in the consortium. The MACALO consortium consists of pioneers of MAgnetoCALOritronics who cover the complete chain from SME start-up company innovation in hardware and software, device simulation and fabrication, benchmark measurements, computational materials science, and basic science, who are committed to employ their expertise to realize the main objectives. The primary goals of MACALO are<br/>1)\tto produce a working prototype of a computer simulation tool to help optimise integrated magnetoelectronic device design parameters at the nanoscale and<br/>2)\tdesign and prototype nano-scale magnetoelectronic RF oscillators with different combinations of desirable properties, optimisable subsequently (through further company research) for specific applications in wireless communication devices.<br/>Achieving these goals assists replacing the current systems of YIG oscillators, MRAM, and transistors with next generation magnetoelectronic Spin Torque Oscillators, ST-RAM, and transistors by finding material combinations, currently based on suboptimal experimental trial and error systems, using a set of theories, principles, tools and methods that accelerate the development of new devices with improved/optimised properties.<br/>Managing the increased heat and noise in the next generation of electronics is a great challenge. MAgneto CALOitronics (MACALO) addresses the modelling and control of the generation and flow of heat in beyond-CMOS magnetoelectronics circuits and devices. The results are relevant for thermal management of conventional CMOS and novel architectures beyond-CMOS such as low power, low-noise devices, thermally assisted memory devices, and interconnects.