Innovating Works

MAGALIGN

Financiado
Magnetic alignment for high precision 3D assembly
In microelectronics, 3D integration and assembly definitely appears as a very efficient option to achieve highly integrated chips. It offers major benefits such as combining heterogeneous technologies, combining high-performance a... In microelectronics, 3D integration and assembly definitely appears as a very efficient option to achieve highly integrated chips. It offers major benefits such as combining heterogeneous technologies, combining high-performance and low-power chips, increasing data transfer bandwidth in memory above logic circuits, etc. 3D assembly is realized by bonding two wafers or chips face to face on a wafer. In this bonding process, the number of interchips interconnects is limited by the accuracy of the alignment process. Presently, alignment methods rely on optical alignment techniques which offer ±0.2m resolution for wafer-to-wafer bonding or only ±1m resolution for die-to-wafer bonding. This is relatively poor and limit the density of interconnects and therefore the bandwidth of interchip communication. In this ERC PoC project, we intend to establish the viability of a novel magnetic alignment approach based on nanomagnetism and spin electronics which could yield unprecedented accuracy in alignment during wafer bonding. The goals of MAGALIGN are i) to make a proof of concept of this novel alignment method, ii) optimize it and develop the design tools to exploit it, iii) Develop industrialization strategy. ver más
30/06/2022
CEA
150K€
Duración del proyecto: 21 meses Fecha Inicio: 2020-09-15
Fecha Fin: 2022-06-30

Línea de financiación: concedida

El organismo H2020 notifico la concesión del proyecto el día 2022-06-30
Línea de financiación objetivo El proyecto se financió a través de la siguiente ayuda:
ERC-2020-POC: Call for proposals for ERC Proof of Concept Grant
Cerrada hace 4 años
Presupuesto El presupuesto total del proyecto asciende a 150K€
Líder del proyecto
COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENER... No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico TRL 4-5