Hola,
¿eres nuevo aquí?

Regístrate gratis y conecta tu empresa con financiación pública, partners y proyectos.

Tengo cuenta

Regístrate

Ver video

PASTA

Financiado

Cerrado

Integrating Platform for Advanced Smart Textile Applications

The PASTA project will combine electronic packaging research and textile research to realize an innovative approach of smart textile. By introducing new concepts for electronic packaging and module interconnect, a seamless, more... ver más

31/03/2015

IMEC

9M€

Presupuesto del proyecto: 9M€

Líder del proyecto

INTERUNIVERSITAIR MICROELECTRONICA CENTRUM No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 10 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2015-03-31 No tenemos la información de la convocatoria

0% 74% 100%

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

10 Participantes

IMEC

0.00€ | Lider

STFI

N.D. | Participante

FOV

N.D. | Participante

FUNDICO

N.D. | Participante

Proyectos interesantes

E-TEX

Electronics

Textile Technol...

195K€ Cerrado

ETexWeld

Textile Enginee...

Software

918K€ Cerrado

TEC2016-79465-R

Electronics

Textile Enginee...

128K€ Cerrado

WEAFING

Textile Technol...

Robotics and Au...

4M€ Cerrado

ThermoTex

Textiles

Wearable Techno...

2M€ Cerrado

IPT-430000-2010-030

Wearable Techno...

Textile Enginee...

134K€ Cerrado

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Líder del proyecto

INTERUNIVERSITAIR MICROELECTRONICA CENTRUM No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 9M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The PASTA project will combine electronic packaging research and textile research to realize an innovative approach of smart textile. By introducing new concepts for electronic packaging and module interconnect, a seamless, more comfortable and more robust integration of electronics in textile will be possible. The main technological developments concentrate on a new concept for bare die integration into a yarn (by means of micromachining), a new interconnect technology based on mechanical crimping and the development of a stretchable interposer serving as a stress relief interface between the rigid component and the elastic fabric. Integration into the yarn will be used for small components and modules (< 1 mm), so that they can be fully integrated and encapsulated and further used in weaving. Larger modules for crimp contacts and with stretchable interposers are mounted on top of fabric substrates. Mechanical simulations will support these technological developments. A dedicated work package on fabric technologies will focus on fabric modifications for accommodating the new electronic packages : conductive yarns and textile-based sensors will be integrated into the basic fabric. And finally, dedicated equipment and manufacturing platforms will be developed for smart textile fabrication with the PASTA technologies. The technologies will be assessed in a functional evaluation and reliability testing program.The proposed solutions for integration of electronics in textile cover a whole range of components, from ultra small LEDs to complex multichip modules. A system design task will tackle the power distribution and system partitioning aspects. This assures that a complete solution is available for integration of a distributed sensor/actuator system in fabric. The concept for the new electronics integration technology will be shown in 4 different demonstrators in the area of technical textiles, sports and leisure wear, home textiles and bed linen.

Conecta tu I+D

Entra hoy

¿Olvidé mi contraseña?

Financiación

Empresas

CTIs/Universidades

Proyectos

Investigadores