Hola,
¿eres nuevo aquí?

Regístrate gratis y conecta tu empresa con financiación pública, partners y proyectos.

Tengo cuenta

Regístrate

Ver video

INSPIRE

Financiado

Cerrado

InP on SiN Photonic Integrated circuits REalized through wafer scale micro trans...

InP on SiN Photonic Integrated circuits REalized through wafer scale micro transfer printing INSPIRE aims to revolutionize photonic integrated circuit technology by combining two technologies, InP photonics and SiN photonics, in a single platform through wafer-scale micro-transfer printing technology. This platform will a... ver más

31/03/2025

TU/e

5M€

Presupuesto del proyecto: 5M€

Líder del proyecto

TECHNISCHE UNIVERSITEIT EINDHOVEN No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 8 Participantes

Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2020-11-30

ICT-37-2020: Advancing photonics technologies an...

I+D

Cerrada hace 4 años

0% 100%

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

8 Participantes

TU/e

812.65K€ | Lider

AMIPEM CONSULTORES

191.59K€ | Participante

SMART Photonics

690.06K€ | Participante

THALES

667.24K€ | Participante

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Proyectos interesantes

PICTURE High Performance and High Yield Heterogeneous III V Si Photo... 4M€ Cerrado

PhotonICSWARM Photonic Integrated Circuits using Scattered Waveguide eleme... 2M€ Cerrado

PID2020-115353RA-I00 METAMATERIALES SUBLONGITUD DE ONDA PARA OPTICA INTEGRADA DE... 94K€ Cerrado

NOLIMITS NOvel Large scale InP Membrane based Integration Technology... 2M€ Cerrado

PATTERN Next generation ultra-high-speed microwave Photonic integrA... 5M€ Cerrado

INPHOMIR INdium PHOsphide-based advanced Monolithically integrated ph... 5M€ Cerrado

Duración del proyecto: 52 meses Fecha Inicio: 2020-11-30
Fecha Fin: 2025-03-31

Líder del proyecto

TECHNISCHE UNIVERSITEIT EINDHOVEN No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 5M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto INSPIRE aims to revolutionize photonic integrated circuit technology by combining two technologies, InP photonics and SiN photonics, in a single platform through wafer-scale micro-transfer printing technology. This platform will allow to combine high-performance III-V opto-electronic components (semiconductor optical amplifiers, high-speed phase modulators and photodetectors) operating in the C-band with the high-performance passive functionality of the SiN platform (high performance filters, 5dB/m waveguide loss), on 200mm wafers. The micro-transfer printing integration approach enables high-throughput integration of III-V devices on SiN photonic integrated circuits with better than 1 um alignment accuracy, resulting in high-performance, low-cost photonic integrated circuits. While being applicable in a wide range of mega-markets, the INSPIRE technology will be validated by three use cases: the case of a distributed fiber sensing readout unit based, the case of a microwave photonics RF pulse generator and a datacenter switch fabric. Compact models of the III-V opto-electronic components will be developed enabling designers to exploit this platform for a wide range of applications. INSPIRE will sustain Europe’s industrial leadership in photonics by combining the generic integrated foundry technology at the pioneering pure-play foundry SmartPhotonics, and the silicon photonics pioneer IMEC, with the micro-transfer printing technology at X-Celeprint, making this a world-first platform combining the strengths of all known PIC manufacturing platforms. It will also strengthen the European manufacturing base by developing and implementing processing steps that are key to removing expensive assembly steps in photonic IC based product realization. The methods will be developed for silicon nitride – indium phosphide integration. Since the optical coupling happens through a silicon intermediate layer the developed technology can be ported to silicon CMOS photonics as well.

Conecta tu I+D

Entra hoy

¿Olvidé mi contraseña?

Financiación

Empresas

CTIs/Universidades

Proyectos

Investigadores