IMOS4ALL
Financiado
InP Membrane on Silicon technology for a broad range of applications
Photonic technologies are key enablers for high-speed, on-demand communications, precision sensors, imaging and metrology. Industry roadmapping initiatives are now showing a clear and pressing need for miniaturising photonics solu...
Photonic technologies are key enablers for high-speed, on-demand communications, precision sensors, imaging and metrology. Industry roadmapping initiatives are now showing a clear and pressing need for miniaturising photonics solutions across market segments with sustained improvements in energy-efficiency, precision and performance. Photonic integration can meet these challenges, and has been convincingly demonstrated in fiber optic systems, but there is an absence of chip scale solutions for connectorless communications and sensor circuits requiring optical wireless connectivity. The necessary combination of high-performance optoelectronics, photonics integration, and chip-scale beam forming is not available to the industry.
IMOS – Indium Phosphide membrane on Silicon enables the combination of nanophotonics, photonic integration, lasers, amplifiers and the highest efficiency electro-optic processes. Integrated nanophotonics offers a route to exquisite optical beam control within the chip, and removes the need for fiber optic connectivity, micro-mechanical-assemblies and off-chip optics. The ERC project NoLimits has pioneered a nanophotonic platform which additionally integrates lasers, semiconductor optical amplifiers, high performance detectors and low-loss, fabrication-tolerant surface grating technologies. The IMOS4ALL program will implement the most comprehensive set of active and nanophotonic building blocks as created in the ERC project NoLimits and make them available within one wafer scale process and valid the platform with industry-inspired circuits. The free placement of standard high-performance building blocks enables the project to deliver an open-access platform where designers configure circuits to enable new and unanticipated circuits. The platform approach also enables the integration of a pipeline of future high-performance building blocks for future technology nodes.
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Duración del proyecto: 21 meses
Fecha Inicio: 2019-06-07
Fecha Fin: 2021-03-31
Fecha Fin: 2021-03-31
Línea de financiación: concedida
El organismo H2020 notifico la concesión del proyecto el día 2021-03-31
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
ERC-2019-POC:
ERC Proof of Concept Grant
Cerrada
hace 5 años
Presupuesto
El presupuesto total del proyecto asciende a
150K€
Líder del proyecto
TECHNISCHE UNIVERSITEIT EINDHOVEN
No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5
260.47K€ |
Participante