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HEECS

financed

High Efficiency Electronics Cooking Systems

The HEECS project will answer the need to increase energy efficiency, developing a smart, controlled and highly efficient Solid state cooking device and give significant contributions to standards. The main project scope is to enh... see more

01/02/2014

unknown leader

5M€

Project Budget: 5M€

Project leader unknown leader

PARTICIPATION DEPralty Sin fecha límite de participación.

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Financing granted El organismo FP7 notifico la concesión del proyecto The day 2014-02-01 We do not have the information of the call

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7 Participantes

Whirlpool Europe srl

TECHNISCHE UNIVERSITEIT DELF...

CHALMERS TEKNISKA HOGSKOLA A...

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Project leader unknown leader

Project Budget 5M€

participation deadline Sin fecha límite de participación.

Project description The HEECS project will answer the need to increase energy efficiency, developing a smart, controlled and highly efficient Solid state cooking device and give significant contributions to standards. The main project scope is to enhance energy efficiency by more than 25% in Microwave ovens (MWOs) across any range of food to be heated or cooked at home. According to this scope, breakthrough technologies will be researched and developed according to 4 HEECS main project objectives: 1) New and improved semiconductor technologies mainly focused on innovative high frequency power solid state devices. 2) Improved thermal management systems to efficiently cool the high frequency power transistor package, and make use of the dissipated heat energy in an efficient way. 3) Intelligent electromagnetic (EM) field adjustment and high frequency controls, in order to better distribute the field intensity within differing food types, thereby heating the food appropriately and decreasing losses. 4) Optimized MWO technology configuration and system architecture delivering optimum feeding and efficiency of the MWO through enhanced signal conditioning. Matching the overall ENIAC objectives, all the electronic parts of the solid state cooking device, including small signal board (frequency synthesizer, High speed RF switching, micro controller), Switched mode power supply unit, high frequency power amplification stages, RF sensing and coupling, will be built with miniaturised circuits. The thermal management of the RF power devices will also incorporate thermal / material aspects relevant to ensure reliability and miniaturisation within the hybrid transistor package. The project will also deliver TCAD, and multi-physics tools enabling design of new technologies related to RF Hybrid circuit integration, phased array controls, and thermal design of High Frequency power transistor packages.

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