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TERIPHIC

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Fabrication and assembly automation of TERabit optical transceivers based on InP...

Fabrication and assembly automation of TERabit optical transceivers based on InP EML arrays and a Polymer Host platform for optical InterConnects up to 2 km and beyond Efforts to develop optical interfaces with Terabit capacity for datacom applications have kicked off. A practical path to the Terabit regime is to scale the current 400G modules, which are based (in the most forward looking versio... ver más

31/03/2023

RESEARCH UNIVERSIT...

6M€

Presupuesto del proyecto: 6M€

Líder del proyecto

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

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Financiación concedida El organismo H2020 notifico la concesión del proyecto el día 2023-03-31

ICT-04-2018: Photonics based manufacturing, acce... Specific Challenge:Photonics research in Europe is widely recognized for its excellence; researchers...

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Información adicional privada

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6 Participantes

RESEARCH UNIVERSITY INSTITUT...

756.25K€ | Lider

Fraunhofer

1.91M€ | Participante

MELLANOX

875.41K€ | Participante

IIIV LAB

556.82K€ | Participante

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Duración del proyecto: 53 meses Fecha Inicio: 2018-10-24
Fecha Fin: 2023-03-31

Líder del proyecto

EREVNITIKO PANEPISTIMIAKO INSTITOUTO SYSTIMAT... No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 6M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto Efforts to develop optical interfaces with Terabit capacity for datacom applications have kicked off. A practical path to the Terabit regime is to scale the current 400G modules, which are based (in the most forward looking version of the standards) on 4 parallel lanes, each operating with PAM-4 at 53 Gbaud. Scaling these modules by adding lanes looks simple, but entails challenges with respect to the fabrication and assembly complexity that can critically affect their manufacturability and cost. TERIPHIC aims to address these challenges by leveraging photonic integration concepts and developing a seamless chain of component fabrication, assembly automation and module characterization processes as the basis for high-volume production lines of Terabit modules. TERIPHIC will bring together EML arrays in the O-band, PD arrays and a polymer chip that will act as the host platform for the integration of the arrays and the wavelength mux-demux of the lanes. The integration will rely on butt-end-coupling steps, which will be automated via the development of module specific alignment and attachment processes on commercial equipment. The optical subassembly will be mounted on the mainboard of the module together with linear driver and TIA arrays. The assembly process will be based on the standard methodologies of MLNX and the use of polymer FlexLines for the interconnection of the optical subassembly with the drivers and the TIAs. Using these methods, TERIPHIC will develop pluggable modules with 8 lanes (800G capacity) and mid-board modules with 16 lanes (1.6T capacity) having a reach of at least 2 km. Compared to the 400G standards, the modules will reduce by 50% the power consumption per Gb/s, and will have a cost of 0.3 Euro/Gb/s. After assembly, the modules will be mounted on the line cards of MLNX switches, and will be tested in real settings. A study for the consolidation of the methods and the set up of a pilot assembly line in the post-project era will be also made.

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