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ERAMP

Financiado

Cerrado

Excellence in Speed and Reliability for More Than Moore Technologies

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electro... ver más

01/04/2017

IFD

55M€

Presupuesto del proyecto: 55M€

Líder del proyecto

INFINEON TECHNOLOGIES DRESDEN GMBH CO KG No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 24 Participantes

Financiación concedida El organismo FP6 notifico la concesión del proyecto el día 2017-04-01 No tenemos la información de la convocatoria

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Información adicional privada

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24 Participantes

IFD

Lider

STUBA

N.D. | Participante

IFRO

N.D. | Participante

JOANNEUM RESEARCH

N.D. | Participante

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Duración del proyecto: 36 meses Fecha Inicio: 2014-04-01
Fecha Fin: 2017-04-01

Líder del proyecto

INFINEON TECHNOLOGIES DRESDEN GMBH CO KG No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 55M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe. eRamp will fully support these targets, in line with the KET-(Key Enabling Technologies) strategy, by strengthening Europe’s leadership in power semiconductors by addressing (a) methodology research and (b) product research. Clear focus is put on fast and reliable product behaviour by rapid learning in European pilot line environments. In addition, eRamp will enable the realization of innovative More-than-Moore devices by development of innovative process and manufacturing chains. Research will focus on enhanced, next generation, More-than-Moore semiconductor product ramp ups, dedicated to energy efficient power, MEMS and 3D based applications. Power technologies based on 300mm wafer diameter will be enforced by combining with advanced assembly technologies. Doing so, eRAMP will foster exploitation for the running projects EPT300 and EPPL.eRamp aims to set an innovative step forward to strengthen Europe’s leading position in More-than-Moore semiconductor technologies and More-than-Moore manufacturing capabilities with an sharp application focus to energy efficient electronic solutions. Fast time-to-market and further improved reliability of More-than-Moore semiconductor products will significantly strengthen the strong position of European electronic industry.The results of eRamp will directly strengthen the competitiveness of several production sites of More than Moore semiconductors in Europe. Novel assembly and packaging technologies will allow optimum use of such devices. Thus, it is one of the essential pillars for the bridge from research to large scale production

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