Hola,
¿eres nuevo aquí?

Regístrate gratis y conecta tu empresa con financiación pública, partners y proyectos.

Tengo cuenta

Regístrate

Ver video

HYPERSOL

Financiado

Cerrado

Environmentally Sustainable Manufacturing of Ultra Functional Miniaturised Consu...

Environmentally Sustainable Manufacturing of Ultra Functional Miniaturised Consumer Electronics Using Hyper Fine Solder Powders The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fuelled by demand from consumers to many ind... ver más

31/07/2013

ASL

2M€

Presupuesto del proyecto: 2M€

Líder del proyecto

ATOMISING SYSTEMS LIMITED No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 8 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2013-07-31 No tenemos la información de la convocatoria

0% 74% 100%

Características del participante

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

8 Participantes

ASL

0.00€ | Lider

MIL

N.D. | Participante

BRUNEL UNIVERSITY LONDON

N.D. | Participante

PRISMA ILEKTRONIKA ABEE

N.D. | Participante

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Líder del proyecto

ATOMISING SYSTEMS LIMITED No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 2M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fuelled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, the huge quantity of Waste Electrical, Electronics Equipment (WEEE) generated and the threat of competition from Asia. To sustain its growth, to manage the impact of WEEE and to face the competition from Asia, the industry needs innovations in key areas. One such area is the drive for ultra-miniaturisation/ultlra-functionality of equipment. Achievement of these twin drivers can reduce raw material requirements, reduce WEEE and deliver a competitive edge to the European industry, moving it up the value chain to high value added and high margin products. The key current road block/limitation to achieving the goal of ultra-miniaturisation/functionality is how to increase the component density on the printed circuit board (PCB). This is currently limited by the availability of hyper fine pitch solder powder pastes. Hypersol aims to deliver solder pastes with solder spheres <10μ to enable PCB manufacturers to more than double the component density on the PCB. In layman’s terms, this would effectively enable more than a doubling of the functions available on your cell phone, satellite navigation system, MP3 player and of course the ubiquitous lap top computer which could soon become a palm top computer. The successful completion of the HYPERSOL project would lift the ultra-miniaturisation/functionality road block and in the process also enable reduction in raw material usage, reduction in WEE, reduction in pollution and associated health costs and also a major reduction in EU energy demand with all its indirect benefits for environment and society.

Conecta tu I+D

Entra hoy

Forgot your password?

Financiación

Empresas

CTIs/Universidades

Proyectos

Investigadores