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E-SCOP

Financiado

Embedded systems Service-based Control for Open manufacturing and Process automa...

E-SCOP project is built under ARTEMIS Sub-programme 4: Embedded systems for manufacturing and process automation. The project aims to overcome the current drawbacks for the shop floor control level (i.e. MES and deterministic / re... ver más

29/02/2016

TUT

6M€

Presupuesto del proyecto: 6M€

Líder del proyecto

TTYSAATIO No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Ver 6 Participantes

Financiación concedida El organismo FP6 notifico la concesión del proyecto el día 2016-02-29

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6 Participantes

TUT

Lider

SCM GROUP SPA

N.D. | Participante

THT

N.D. | Participante

WARSAW UNIVERSITY OF TECHNOL...

N.D. | Participante

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Últimas noticias

29-11-2024: IDAE En las últimas 48 horas el Organismo IDAE ha otorgado 4 concesiones

29-11-2024: ECE En las últimas 48 horas el Organismo ECE ha otorgado 2 concesiones

29-11-2024: CMVAMADRID En las últimas 48 horas el Organismo CMVAMADRID ha otorgado 37 concesiones

Duración del proyecto: 35 meses Fecha Inicio: 2013-03-01
Fecha Fin: 2016-02-29

Líder del proyecto

TTYSAATIO

TRL 4-5

Presupuesto del proyecto 6M€

Descripción del proyecto E-SCOP project is built under ARTEMIS Sub-programme 4: Embedded systems for manufacturing and process automation. The project aims to overcome the current drawbacks for the shop floor control level (i.e. MES and deterministic / real-time control), thus improving the state of the art of the overall production control system architecture. This goal is achieved by introducing an innovative approach based on the combination of 3 different pillars, namely: i) embedded systems, ii) ontology-based knowledge management and iii) service-oriented architecture. The approach is called Open, Knowledge-Driven Manufacturing Execution System (OKD-MES).Traditionally embedded devices have limited resources in terms of memory and processing (CPU) capabilities. However the development of communication technologies made it possible and affordable to integrate heterogeneous devices into a large networks as it become possible to implement on embedded devices different protocols stacks developed by World Wide Web Consortium (W3C). This includes web services protocols. A number of European and national projects have already demonstrated how to use web services at the level of embedded devices in the field of manufacturing. However, the integrated approach for manufacturing system development that would focus on provisioning of missing and supporting services that operate together with embedded devices has still to be developed. One of the main results for E-SCOP project is a service-oriented middleware that should allow to build and simulate factory and process control systems.On general level, the proposed E-SCOP architecture is composed of three layers i) Physical layer, ii) Representation Layer and iii) Orchestration Layer.Approved by ARTEMIS-JU on 21/02/2013

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