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E-SCOP

financed

Embedded systems Service-based Control for Open manufacturing and Process automa...

Embedded systems Service-based Control for Open manufacturing and Process automation E-SCOP project is built under ARTEMIS Sub-programme 4: Embedded systems for manufacturing and process automation. The project aims to overcome the current drawbacks for the shop floor control level (i.e. MES and deterministic / re... see more

29/02/2016

TUT

6M€

Project Budget: 6M€

Project leader

TTYSAATIO No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

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Financing granted El organismo FP6 notifico la concesión del proyecto The day 2016-02-29 We do not have the information of the call

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6 Participantes

TUT

Leader

SCM GROUP SPA

N.D. | participant

THT

N.D. | participant

WARSAW UNIVERSITY OF TECHNOL...

N.D. | participant

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Project duration: 35 months Date Start: 2013-03-01
End date: 2016-02-29

Project leader

TTYSAATIO No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 6M€

participation deadline Sin fecha límite de participación.

Project description E-SCOP project is built under ARTEMIS Sub-programme 4: Embedded systems for manufacturing and process automation. The project aims to overcome the current drawbacks for the shop floor control level (i.e. MES and deterministic / real-time control), thus improving the state of the art of the overall production control system architecture. This goal is achieved by introducing an innovative approach based on the combination of 3 different pillars, namely: i) embedded systems, ii) ontology-based knowledge management and iii) service-oriented architecture. The approach is called Open, Knowledge-Driven Manufacturing Execution System (OKD-MES).Traditionally embedded devices have limited resources in terms of memory and processing (CPU) capabilities. However the development of communication technologies made it possible and affordable to integrate heterogeneous devices into a large networks as it become possible to implement on embedded devices different protocols stacks developed by World Wide Web Consortium (W3C). This includes web services protocols. A number of European and national projects have already demonstrated how to use web services at the level of embedded devices in the field of manufacturing. However, the integrated approach for manufacturing system development that would focus on provisioning of missing and supporting services that operate together with embedded devices has still to be developed. One of the main results for E-SCOP project is a service-oriented middleware that should allow to build and simulate factory and process control systems.On general level, the proposed E-SCOP architecture is composed of three layers i) Physical layer, ii) Representation Layer and iii) Orchestration Layer.Approved by ARTEMIS-JU on 21/02/2013

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