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FAB2ASM

Financiado

Cerrado

Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabricat...

Efficient and Precise 3D Integration of Heterogeneous Microsystems from Fabrication to Assembly FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D in... ver más

30/04/2013

AALTO

7M€

Presupuesto del proyecto: 7M€

Líder del proyecto

AALTO KORKEAKOULUSAATIO SR No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 10 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2013-04-30 No tenemos la información de la convocatoria

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Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

10 Participantes

AALTO

0.00€ | Lider

NXP SEMICONDUCTORS NETHERLAN...

N.D. | Participante

STMICROELECTRONICS SRL

N.D. | Participante

EMPA

N.D. | Participante

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Líder del proyecto

AALTO KORKEAKOULUSAATIO SR No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 7M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates. This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as well as the density of the connections. The state-of-the-art integration technology for 3D microsystems relies on robotic pick-and-placing machines and machine vision, which cannot achieve simultaneously high-speed and high-precision. If high precision e.g. a micron is needed, either the cycle time of integration can be very long, from e.g. over ten seconds to minutes, or even not achievable. The objective of the FAB2ASM is to develop highly efficient and precise die-level component integration technology based on hybrid assembly technology that joins robotic tools and self-alignment and corresponding interfacing methods for multi-functional microsystems. In contrast to most explorative self-assembly technology developed to-date, FAB2ASM attempts to develop a highly industry relevant technology that reuses most of the industrial process steps, but on the other hand dramatically improves the performance of the integration process in the precision and efficiency chart. FAB2ASM will allow handling small (100 µm) and/or thin dies (20 µm), ultra high speed assembly (40,000 UPH), and flip-chip capabilities, while ensuring industry proven reliability. Led by AALTO, this consortium of 5 research centers and 4 industries (ST, NXP, BX, 3DPLUS) will join force to fulfil this urgent and important need of industry in 3D integration, and will demonstrate the merits in three industry led demonstrators: one manufacturing equipment demonstrator, one photonic IC demonstrator and 3D microelectronics demonstrator.

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