Hola,
Are you new here?

I have an account

Conecta con

+150K Projects

+300K Companies

+230 Financiaciones

¿Te ayudamos?

Ejemplos de búsqueda

Vídeos Explicativos

DIMENSION

financed

Closed

Directly Modulated Lasers on Silicon

DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers... see more

30/09/2020

TUD

3M€

Project Budget: 3M€

Project leader

TECHNISCHE UNIVERSITAET DRESDEN No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

PARTICIPATION DEPralty Sin fecha límite de participación.

Ver 6 Participantes

Financing granted El organismo H2020 notifico la concesión del proyecto The day 2020-09-30

ICT-27-2015: Photonics KET Scope:Specific Challenge: Further major S&T progress and R&I investments are required for sustaining...

I+D

Cerrada does 10 years

0% 77% 100%

characteristics of the participant

Este proyecto no cuenta con búsquedas de partenariado abiertas en este momento.

Private Information

No hay información privada compartida para este proyecto. Habla con el coordinador.

6 Participantes

TUD

705.50K€ | Leader

LEIBNIZ-INSTITUT FUR INNOVAT...

800.63K€ | participant

IBM

800.37K€ | participant

AIT

270.63K€ | participant

Conecta tu I+D

¿Tienes un proyecto y buscas un partner? Gracias a nuestro motor inteligente podemos recomendarte los mejores socios y ponerte en contacto con ellos. Te lo explicamos en este video

Project duration: 58 months Date Start: 2015-11-11
End date: 2020-09-30

Project leader

TECHNISCHE UNIVERSITAET DRESDEN No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Project Budget 3M€

participation deadline Sin fecha límite de participación.

Project description DIMENSION establishes a truly integrated electro-optical platform, extending the silicon (Bi)CMOS and silicon photonics platform with III-V photonic functionality. The III-V integration concept is fully CMOS compatible and offers fundamental advantages compared to state-of-the art integration approaches. After bonding and growing ultra-thin III-V structures onto the silicon front-end-of-line, the active optical functions are embedded into the back-end of line stack. This offers great opportunities for new innovative devices and functions at the chip-level but also for the assembly of such silicon devices. As processing takes place on silicon wafers, this project has the unique opportunity to bring the cost of integrated devices, with CMOS, photonic and III-V functionality, down to the cost of silicon volume manufacturing. Such a platform has the potential to allow Europe to take a leading position in the field of high functionality integrated photonics. Moreover, the project demonstrators adhere to standards such as IEEE802.3, 25G optical components and low-power electronics, thus opening a viable route towards ultra-low-cost high-performance optical transceivers for a new era of data centres and cloud systems. DIMENSION will realise three demonstrators: • A short-reach transmitter for intra-datacenter operation addressing the 400 GbE-LR8 (IEEE 802.3bs) standard making use of an array of directly modulated lasers, pulse-amplitude-modulation (PAM4) techniques and 8 wavelength channels in the telecom O-band. • A medium-reach transmitter for inter-datacenter applications beyond the 400 GbE-LR8 (IEEE 802.3bs) standard by providing a tuneable coherent transmitter for inter-datacenter and metro applications for link lengths in excess of 10km using a modulator integrated on the same chip. • A novel laser directly grown on silicon photonics, operated at 25Gb/s in the telecom O-band demonstrating the significant cost-saving potential of the technologies pursued in DIMENSION.

Conecta tu I+D

Entra hoy

Forgot your password?

Financing

Companies

CTIs/Universidades

Projects

researchers

What is innovating.Works? Lose yourself in the best search engine for innovative companies you've ever seen, see how your competition is funded, connect with that partner you didn't know about, discover R&D projects that need you, and much, much more just a click away.

Smart Company-Financial Motor Innovating tiene un perfil tecnológico financiero de 400.000 empresas gracias al cual sabe a qué ayuda puede ir o no cualquier empresa de forma automática. Parece magia pero es tecnología.

Create your project and find partners ¿Tienes un proyecto y buscas un partner? Una Universidad, Centro Tecnológico, Consultoría? Este es tu sitio. Gracias al motor de búsqueda podemos recomendarte los mejores socios y ponerte en contacto con ellos.