Cryoetch
Financiado
Computer modelling and experimental validation of plasmas and plasma surface in...
Computer modelling and experimental validation of plasmas and plasma surface interactions for a deep insight in cryogenic etching
Microchips have caused a revolution in electronics over the last few decades. Following Moore's law, much effort has been put into continuously shrinking electronic feature dimensions. Indeed, typical feature sizes of semi-conduct...
Microchips have caused a revolution in electronics over the last few decades. Following Moore's law, much effort has been put into continuously shrinking electronic feature dimensions. Indeed, typical feature sizes of semi-conductor decreased from 10 µm in 1971 to 14 nm in 2014. With the shrinkage of feature sizes, plasma etching plays a more and more important role due to its anisotropy during surface processing.
However, to go beyond 14 nm features, current state-of-the-art plasma processing faces significant challenges, such as plasma induced damage. Recently, one such novel process with limited plasma damage is cryogenic etching of low-k material with SF6/O2/SiF4 and CxFy plasmas.
In this project, the fundamental mechanisms of the plasma, and its interaction with the surface, for these gas mixtures, will be studied to improve cryogenic plasma etching.
For this purpose, numerical models (a hybrid Monte Carlo - fluid model and molecular dynamics model) will be employed to describe (i) the plasma behavior for SF6/O2/SiF4 and CxFy gas mixtures applied for cryogenic etching, and (ii) the surface interactions of the plasma species with the substrate during etching.
Furthermore, cryogenic etch experiments will also be conducted to validate the modeling results during the secondment. Such an interdisciplinary project, including chemistry, physics, mathematics, computer modeling and chemical engineering, will definitely widen the applicant’s expertise in different plasma investigation approaches.
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Duración del proyecto: 26 meses
Fecha Inicio: 2016-03-14
Fecha Fin: 2018-06-07
Fecha Fin: 2018-06-07
Línea de financiación: concedida
El organismo H2020 notifico la concesión del proyecto el día 2018-06-07
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
MSCA-IF-2015-EF:
Marie Skłodowska-Curie Individual Fellowships (IF-EF)
Cerrada
hace 9 años
Presupuesto
El presupuesto total del proyecto asciende a
161K€
Líder del proyecto
UNIVERSITEIT ANTWERPEN
No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5
505.50K€ |
Participante