Innovating Works

BIANCHO

Financiado
BIsmide And Nitride Components for High temperature Operation
BIANCHO will develop photonic components designed to significantly reduce power consumption at the component and system level in advanced communication systems, thereby saving significant electricity, and enabling unlimited bandw... BIANCHO will develop photonic components designed to significantly reduce power consumption at the component and system level in advanced communication systems, thereby saving significant electricity, and enabling unlimited bandwidth through integration, more optical processing and very high spectral-density photonic transmission.<br/>Current telecomm components suffer severely from intrinsic losses. Around 80% of electrical power is wasted in a 1.55?m laser chip as heat. Most systems require thermo-electric coolers and an air-conditioned environment, further increasing the energy budget by over an order of magnitude. The losses are due to Auger recombination in semiconductor lasers and optical amplifiers (SOAs), and due to the temperature dependence of the energy gap in electro-absorption modulators (EAMs). Incremental approaches to overcome these problems have reached their limits. We propose a radical change, to manipulate the electronic band structure of novel dilute bismide and dilute nitride alloys of GaAs and InP to eliminate Auger recombination and dramatically reduce the temperature dependence of the energy gap. This allows us to research, develop, test and demonstrate uncooled EAMs, highly efficient uncooled lasers and SOAs. These properties are also highly beneficial for high speed photodiodes as required in transceivers, as will be demonstrated.<br/>BIANCHO brings together leading European groups with complementary expertise in epitaxy, device physics, band structure modelling and advanced design and fabrication, in a well focused consortium of exceptionally high quality. The project will strongly emphasise the protection of intellectual property and aggressive dissemination of results to maximize their impact. The team includes a key European component manufacturer (CIP), well connected to European and international network and system operators, providing a clear route to successful exploitation and commercialization of the technology. ver más
31/07/2014
UCC
3M€

Línea de financiación: concedida

El organismo FP7 notifico la concesión del proyecto el día 2014-07-31
Presupuesto El presupuesto total del proyecto asciende a 3M€
Líder del proyecto
UNIVERSITY COLLEGE CORK NATIONAL UNIVERSITY... No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico TRL 4-5