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ATHENIS

Financiado

Cerrado

Automotive Tested High voltage Embedded Non volatile memory Integrated SoC

More than 20% of the value of each car already comes from embedded electronics. Keeping costs and space for additional functionality low requires further integration of electronic components such as low and high voltage devices an... ver más

31/12/2010

AMS-OSRAM AG

8M€

Presupuesto del proyecto: 8M€

Líder del proyecto

AMSOSRAM AG No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Fecha límite participación Sin fecha límite de participación.

Ver 7 Participantes

Financiación concedida El organismo FP7 notifico la concesión del proyecto el día 2010-12-31 No tenemos la información de la convocatoria

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Información adicional privada

No hay información privada compartida para este proyecto. Habla con el coordinador.

7 Participantes

AMS-OSRAM AG

0.00€ | Lider

FBK

N.D. | Participante

VALEO ELECTRICAL SYSTEMS

N.D. | Participante

Unife

N.D. | Participante

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Líder del proyecto

AMSOSRAM AG No se ha especificado una descripción o un objeto social para esta compañía.

TRL 4-5

Presupuesto del proyecto 8M€

Fecha límite de participación Sin fecha límite de participación.

Descripción del proyecto More than 20% of the value of each car already comes from embedded electronics. Keeping costs and space for additional functionality low requires further integration of electronic components such as low and high voltage devices and memory on a single System-on-Chip (SoC). SoC technologies for segments with lower reliability requirements are already available. However, there are no cost-effective technologies yet combining all of the harshest automotive reliability requirements for full SoC integration of powertrain ICs for engines, starters, alternators, etc. This barrier to powertrain IC SoC integration inhibits cost reduction and introduction of more fuel efficient cars. <br/>The purpose of ATHENIS is to provide proof of concept for the industry's first SoC technology platform that can surmount these integration barriers. The ATHENIS SoC technology platform is intended to be the first in meeting the combination of all of the harshest requirements including full reverse polarity capability at the low cost of CMOS, application voltages up to 120V, currents up to 10A, temperatures up to 200°C, embedded non-volatile memory, chip-level ESD up to =8kV HBM, and high logic gate densities. <br/>This will be achieved by combining HVCMOS technology from austriamicrosystems AG with MEMS-based "Nanomech" embedded Non-Volatile Memory (eNVM) technology from Cavendish Kinetics. Innovative (patent pending) add-on technology modules such as reverse polarity HVCMOS and =8kV ESD structures for HVCMOS as well as automotive extensions for Nanomech will be developed. An alternator-like demonstrator with and without eNVM is selected for a worst case proof of concept. eNVM will enable "flexibility" to software-configure alternator systems for multiple car platforms. Valeo Electrical Systems will provide system specifications, system development and system evaluation. The other research partners contribute the required novel characterization, reliability, test, and simulation methodology.

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