PLASMOfab
Financiado
A generic CMOS compatible platform for co integrated plasmonics photonics electr...
A generic CMOS compatible platform for co integrated plasmonics photonics electronics PICs towards volume manufacturing of low energy small size and high performance photonic devices
PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-in...
PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances:
1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics
2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip.
The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.
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Duración del proyecto: 37 meses
Fecha Inicio: 2015-11-10
Fecha Fin: 2018-12-31
Fecha Fin: 2018-12-31
Línea de financiación: concedida
El organismo H2020 notifico la concesión del proyecto el día 2018-12-31
Línea de financiación objetivo
El proyecto se financió a través de la siguiente ayuda:
ICT-27-2015:
Photonics KET
Cerrada
hace 9 años
Presupuesto
El presupuesto total del proyecto asciende a
4M€
Líder del proyecto
ARISTOTELIO PANEPISTIMIO THESSALONIKIS
No se ha especificado una descripción o un objeto social para esta compañía.
Perfil tecnológico
TRL
4-5
Perfil tecnológico
TRL
4-5
344.20K€ |
Participante
569.51K€ |
Participante
355.00K€ |
Participante