HORIZON EUROPE
European
ExpectedOutcome:Projects are expected to contribute to the following outcomes:
Innovative semiconductor and micro-nanoelectronic systems design concepts supporting very low energy consumption, integrated security, connectivity, sensing, actuating and embedded functions suited to mixed analogue/RF and digital circuits.Alternative[1] semiconductor manufacturing process technologies able to sustain in the mid- and long-terms the fast pace evolution of device performance, miniaturisation and cost, while reducing environmental footprint.Very advanced packaging solutions aiming at extreme miniaturisation and integration of multiple functions such as communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration
Scope:Proposals should:
Address low-TRL research with high potential not yet demonstrated in the design, fabrication process and/or packaging segments of the micro-nano-electronics and integration technologies value chain.Innovation focus can be on materials, physic concepts, device architecture or integration technologies.Provide a projection of the expected gains and main figures of merit of the proposed appro...
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ExpectedOutcome:Projects are expected to contribute to the following outcomes:
Innovative semiconductor and micro-nanoelectronic systems design concepts supporting very low energy consumption, integrated security, connectivity, sensing, actuating and embedded functions suited to mixed analogue/RF and digital circuits.Alternative[1] semiconductor manufacturing process technologies able to sustain in the mid- and long-terms the fast pace evolution of device performance, miniaturisation and cost, while reducing environmental footprint.Very advanced packaging solutions aiming at extreme miniaturisation and integration of multiple functions such as communication (RF, mmW or THz), sensing, actuating, power management and active/passive integration
Scope:Proposals should:
Address low-TRL research with high potential not yet demonstrated in the design, fabrication process and/or packaging segments of the micro-nano-electronics and integration technologies value chain.Innovation focus can be on materials, physic concepts, device architecture or integration technologies.Provide a projection of the expected gains and main figures of merit of the proposed approaches. Multi-disciplinary research activities should be address along part of the value chain from materials, processes, equipment, metrology, back-end processing to packaging, integration and tests.
International cooperation is encouraged, especially with leading semiconductor countries (e.g. Japan, South Korea, Taiwan) in support of EU policies (and outcome of the CSA on Int’ cooperation in SC).
In this topic the integration of the gender dimension (sex and gender analysis) in research and innovation content is not a mandatory requirement.
Specific Topic Conditions:Activities are expected to start at TRL 1-2 and achieve TRL 3-4 by the end of the project – see General Annex B.
[1]Alternative to mainstream Silicon CMOS technologies
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Consortium characteristics
:
The aid is European, you can apply to this line any company that is part of the European Community.
characteristics of the Proyecto
Expenses related to personnel working directly on the project are based on actual hours spent, based on company costs, and fixed ratios for certain employees, such as the company's owners.
Payments to external third parties to perform specific tasks that cannot be performed by the project beneficiaries.
They include the acquisition of equipment, amortization, material, licenses or other goods and services necessary for the execution of the project
Miscellaneous expenses such as financial costs, audit certificates or participation in events not covered by other categories
Overhead costs not directly assignable to the project (such as electricity, rent, or office space), calculated as a fixed 25% of eligible direct costs (excluding subcontracting).
Characteristics of financing
For the eligible budget, the intensity of the aid in the form of a lost fund may reach as minimum a 100%.
Additional information about the call
other advantages
